NOTABLE LINKS
Georgia Institute of Technology: - Packaging Research Center - ECE Profile - MSE Profile - "Tummala Receives Tech's Highest Faculty Award" (June 1998) - "Think Small (and Cheap)" (1995) - "SOP for Multifunctional System Packages" (Mar 2006)
GT Research Horizons "Moving Next-Generation Electronics Beyond Moore's Law"
IEEE Spectrum "Moore's Law Meets Its Match" (June 2006)
Georgia Research Alliance Rao Tummala: Eminent Scholar
Chip Scale Review "System-on-Package Integrates Multiple Tasks" (Feb 2004)
American Ceramic Society "Profiles in Ceramics: Electronic Packaging (1999, PDF)
IBM "High Performance Glass-Ceramic/Copper Multilayer Substrate with Thin-film Redistribution" (1992, PDF)
Jacket Micro Devices Advisory Board Member
CAREER MILESTONES
2007 Will Publish first textbook on SOP technologies, "Introduction to System-on-Package (SOP)"
2007 IEEE David Feldman Award, highest honor by the IEEE-CPMT Society for outstanding contributions in leadership and global impact
2001 Published first packaging textbook, "Fundamentals of Microsystems Packaging"
2000 President of IEEE-CPMT
1998 Distinguished Professor of the Year, Georgia Institute of Technology
1998 Distinguished Alumni of the Year, Indian Institute of Science
1997 Published Microelectronics Packaging Handbook in three volumes: “Technology Drivers,” “System Level Technologies” and “Packaging Technologies”
1997 European Materials Award of the Year, DVM Society
1997 Honorary Visiting Professor, Chinese Academy of Sciences, Fudan University
1997 Total Excellence in Electronics Manufacturing (TEEM) Award, SME
1997 John Jeppson Medallist, ACerS
1996 President of IMAPS
1995 NSF accepts Tummala’s proposal for funding Packaging Research Center
1993 Joined Georgia Institute of Technology, Petit Chair Professor
1993 Technical Achievement Award, IEEE-CHMT
1993 Arthur Friedberg Memorial Lecture, ACerS
1993 David Sarnoff Award, IEEE
1993 Fellow, Institute of Electronic, Electrical Engineers (IEEE)
1992 Engineering Materials Achievement Award, ASM International
1992 John Wagnon Technical Achievement Award, ISHM
1992 Member, National Academy of Engineering
1991 Distinguished Alumni Honor Award, University of Illinois
1984-93 IBM Fellow
1984 Fellow, The American Ceramic Society (ACerS)
1978 Invented and pioneered the first low-temperature ceramic module (63 layers)
1976 Developed first multichip module (35 layers)
1968 Joined IBM Corp.
1968 University of Illinois, Ph.D. in materials science and engineering
1965 Queens University (Canada), M.S. in metallurgical engineering
1963 Indian Institute of Science (Bangalore, India), B.E.
1961 Loyola College (India), B.S. in physics, mathematics and chemistry
Contact Information Phone: (404) 894-9097 Fax: (404) 894-3842 Email: rao.tummala@ece.gatech.edu Georgia Institute of Technology Packaging Research Center Manufacturing Research Center (MaRC) Building 813 Ferst Drive, Room 351 Mail Code: 0250 Atlanta, GA 30332-0250