Global Industry Collaborations
During Rao Tummala's directorship (1994-present) at Georgia Tech's Packaging Research Center, research collaborations with these global microelectronics packaging companies occurred:
- Alcatel
- Altera
- AMD
- Army Aviation and Missile Command
- Asahi Glass Co.
- Atotech Electronics
- Cookson Corp.
- DuPont EKC
- Dupont Electronic Technologies
- Endicott Interconnect Technologies
- Ericsson
- Fein Focus USA
- Georgia Research Alliance
- Hirami Chemical
- Hitachi Chemical
- Hitachi Electronics
- IBM Systems & Technology Group
- IBM Test Development
- Intel
- Intel Enterprise Platform Group
- IZM Fraunhofer
- Jacket Micro Devices
- JDS Uniphase
- Lambda Technologies
- Matsushita Electric Works
- Motorola
- National Semiconductor Corporation
- National Starch & Chemicals
- NIST Semiconductor Electronics Division
- Nokia
- NEC
- Northrop Grumman
- NTK
- Oak Mitsui
- Panasonic
- PARC Inc.
- Raytheon Corporation
- Rockwell Collins
- Rohm and Haas
- Samsung Electronics
- Samsung Techwin
- Seagate
- Semco
- Sharp Labs
- SONY Semiconductor Division
- Starfire Systems
- Texas Instruments