NOTABLE LINKS
Georgia Institute of Technology: - Packaging Research Center - ECE Profile - MSE Profile - "Tummala Receives Tech's Highest Faculty Award" (June 1998) - "Think Small (and Cheap)" (1995) - "SOP for Multifunctional System Packages" (Mar 2006)
GT Research Horizons "Moving Next-Generation Electronics Beyond Moore's Law"
IEEE Spectrum "Moore's Law Meets Its Match" (June 2006)
Georgia Research Alliance Rao Tummala: Eminent Scholar
Chip Scale Review "System-on-Package Integrates Multiple Tasks" (Feb 2004)
American Ceramic Society "Profiles in Ceramics: Electronic Packaging (1999, PDF)
IBM "High Performance Glass-Ceramic/Copper Multilayer Substrate with Thin-film Redistribution" (1992, PDF)
Jacket Micro Devices Advisory Board Member
During Rao Tummala's directorship (1994-present) at Georgia Tech's Packaging Research Center, research collaborations with these global microelectronics packaging companies occurred: Alcatel Altera AMD Army Aviation and Missile Command Asahi Glass Co. Atotech Electronics Cookson Corp. DuPont EKC Dupont Electronic Technologies Endicott Interconnect Technologies Ericsson Fein Focus USA Georgia Research Alliance Hirami Chemical Hitachi Chemical Hitachi Electronics IBM Systems & Technology Group IBM Test Development Intel Intel Enterprise Platform Group IZM Fraunhofer Jacket Micro Devices JDS Uniphase Lambda Technologies Matsushita Electric Works Motorola National Semiconductor Corporation National Starch & Chemicals NIST Semiconductor Electronics Division Nokia NEC Northrop Grumman NTK Oak Mitsui Panasonic PARC Inc. Raytheon Corporation Rockwell Collins Rohm and Haas Samsung Electronics Samsung Techwin Seagate Semco Sharp Labs SONY Semiconductor Division Starfire Systems Texas Instruments
During Rao Tummala's directorship (1994-present) at Georgia Tech's Packaging Research Center, research collaborations with these global microelectronics packaging companies occurred: